Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/19178
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dc.contributor.authorKoh, Belvin Tong Deng.-
dc.date.accessioned2009-10-26T03:50:00Z-
dc.date.available2009-10-26T03:50:00Z-
dc.date.copyright2007en_US
dc.date.issued2007-
dc.identifier.urihttp://hdl.handle.net/10356/19178-
dc.description.abstractThis Industrial Attachment Final Report provides readers with insights into the work accomplished and experience gained during the author’s 22-week attachment programme with Leica Instruments (Singapore) Pte Ltd at the Assembly Department. The author participated in 3 new product start-ups (Zett-Blendenmodul, Discovery Turrets and Valentine Turrets). Reverse engineering and experiments were conducted; alignment and other assembly devices were designed and fabricated through sub-contractors. Assembly and functional analysis of the prototypes were completed prior delivery for qualification. The author had also participated in the manufacturing engineering management processes, such as product and process planning, of these projects. Projects tracking lists, build-of-materials, sequence plans, test protocols, project-meeting minutes were done during the attachment period. Finally, the author had the opportunity to participate in work processes improvement events like Standard-Work, One-Piece Flow and 5S, for Pluto production cell which exposes him to the various principles governing the concept of Lean Manufacturing.en_US
dc.format.extent102 p.en_US
dc.language.isoenen_US
dc.rightsNanyang Technological University-
dc.subjectDRNTU::Engineering::Mechanical engineeringen_US
dc.titleReport on industrial attachment with Leica Instruments (Singapore) Pte Ltden_US
dc.typeIndustrial Attachment (IA)en_US
dc.contributor.supervisorMiao Jianminen_US
dc.contributor.schoolSchool of Mechanical and Aerospace Engineeringen_US
dc.contributor.supervisor2Phua Yong Sweeen_US
dc.contributor.supervisor2Hong James Jian Yaoen_US
item.grantfulltextrestricted-
item.fulltextWith Fulltext-
Appears in Collections:MAE Student Reports (FYP/IA/PA/PI)
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