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|Title:||Report on industrial attachment with Renesas Technology Singapore Pte Ltd||Authors:||Ang, Kian Liong||Keywords:||DRNTU::Engineering::Computer science and engineering||Issue Date:||2009||Abstract:||This report contains a summary of the student Industrial Attachment (IA) experience in Renesas Technology Singapore Pte Ltd (RTSP). RTSP is a sale office of Renesas Technology Corporation in Singapore. While working in RTSP, the student is given the project to improve the touchscreen LCD development kit. The existing software of the touchscreen LCD development kit does not have multi-tasking capability, graphic middleware, LCD memory management, good touchscreen design and the software is not portable. The drivers of devices also had inconsistent structure. The student then did studies on the related topics and made improvement to the graphic middleware and drivers. He also added an operating system, micro T-Kernel, to allow applications to use the multi-tasking capability and portability of the operating systems. Finally, with these improvements, applications were created to show case the capability of the development kit.||URI:||http://hdl.handle.net/10356/19179||Rights:||Nanyang Technological University||Fulltext Permission:||restricted||Fulltext Availability:||With Fulltext|
|Appears in Collections:||SCSE Student Reports (FYP/IA/PA/PI)|
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