Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/19328
Title: Electroplating of copper for application in sub-0.25 micron device manufacturing
Authors: Seah, Chin Hwee.
Keywords: DRNTU::Science
Issue Date: 2000
Abstract: An in-depth study of the copper electroplating process was carried out with different process parameters such as seed materials, current densities and electrolytes in order to fabricate nanocrystalline electroplated copper to fill up the line and via trenches in sub-0.25 urn devices. The effect of annealing on the morphology and properties of the electroplated copper was also investigated.
URI: http://hdl.handle.net/10356/19328
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:SAS Theses

Files in This Item:
File Description SizeFormat 
SeahChinHwee-SAS.pdf
  Restricted Access
19.83 MBAdobe PDFView/Open

Google ScholarTM

Check

Items in DR-NTU are protected by copyright, with all rights reserved, unless otherwise indicated.