Non-conductive adhesives for micro joining in semiconductor interconnect applications

Abstract

This work addresses the impact of NCA materials employed on the reliability performance of flip-chip package. Four commercially available non-conductive adhesives (NCAs), designed as NCA-A, NCA-B, NCA-C and NCA-D were investigated. The test vehicle used as a 4x4 mm, electroless Ni-Au bumped flip-chip assembled on FR4 epoxy printed circuit board (PCB) substrates with NCAs.