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|Title:||Non-conductive adhesives for micro joining in semiconductor interconnect applications||Authors:||Teh, Lay Kuan.||Keywords:||DRNTU::Engineering::Materials||Issue Date:||2003||Abstract:||This work addresses the impact of NCA materials employed on the reliability performance of flip-chip package. Four commercially available non-conductive adhesives (NCAs), designed as NCA-A, NCA-B, NCA-C and NCA-D were investigated. The test vehicle used as a 4x4 mm, electroless Ni-Au bumped flip-chip assembled on FR4 epoxy printed circuit board (PCB) substrates with NCAs.||URI:||http://hdl.handle.net/10356/19332||Fulltext Permission:||restricted||Fulltext Availability:||With Fulltext|
|Appears in Collections:||MSE Theses|
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