Please use this identifier to cite or link to this item:
Title: Non-conductive adhesives for micro joining in semiconductor interconnect applications
Authors: Teh, Lay Kuan.
Keywords: DRNTU::Engineering::Materials
Issue Date: 2003
Abstract: This work addresses the impact of NCA materials employed on the reliability performance of flip-chip package. Four commercially available non-conductive adhesives (NCAs), designed as NCA-A, NCA-B, NCA-C and NCA-D were investigated. The test vehicle used as a 4x4 mm, electroless Ni-Au bumped flip-chip assembled on FR4 epoxy printed circuit board (PCB) substrates with NCAs.
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MSE Theses

Files in This Item:
File Description SizeFormat 
  Restricted Access
3.12 MBAdobe PDFView/Open

Google ScholarTM


Items in DR-NTU are protected by copyright, with all rights reserved, unless otherwise indicated.