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Title: Fine pitch electroless nickel plating
Authors: Zee, Bernice Mei Lin
Keywords: DRNTU::Engineering::Materials
Issue Date: 2004
Abstract: Electroless nickel (EN) plating is a viable interconnection material for flip chip applications due to its process simplicity and low cost. The selective nature of EN plating allows the possibility of a maskless, waferscale process for the fabrication of fine pitch interconnects and this makes it one of the most promising techniques for fine pitch applications.
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MSE Theses

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