Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/19344
Title: Processing and characterization of electrically conductive adhesives
Authors: Yong, Sim Seah.
Keywords: DRNTU::Engineering::Materials
Issue Date: 2004
Abstract: Electrically Conductive Adhesives (ECAs) are fast emerging as a promising solder alternative solutions. It is playing an increasingly important role in the design and production of electronic packages. Fewer processing steps and lower curing temperatures as compared to the solder technology are the main reasons driving their increasing implementation in microelectronics packaging.
URI: http://hdl.handle.net/10356/19344
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MSE Theses

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