Please use this identifier to cite or link to this item:
Title: Processing and characterization of electrically conductive adhesives
Authors: Yong, Sim Seah.
Keywords: DRNTU::Engineering::Materials
Issue Date: 2004
Abstract: Electrically Conductive Adhesives (ECAs) are fast emerging as a promising solder alternative solutions. It is playing an increasingly important role in the design and production of electronic packages. Fewer processing steps and lower curing temperatures as compared to the solder technology are the main reasons driving their increasing implementation in microelectronics packaging.
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MSE Theses

Files in This Item:
File Description SizeFormat 
  Restricted Access
8.3 MBAdobe PDFView/Open

Page view(s) 10

checked on Sep 28, 2020

Download(s) 10

checked on Sep 28, 2020

Google ScholarTM


Items in DR-NTU are protected by copyright, with all rights reserved, unless otherwise indicated.