Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/19554
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dc.contributor.authorPark, Jong Chun.en_US
dc.date.accessioned2009-12-14T06:14:59Z-
dc.date.available2009-12-14T06:14:59Z-
dc.date.copyright1997en_US
dc.date.issued1997-
dc.identifier.urihttp://hdl.handle.net/10356/19554-
dc.description.abstractProcess optimization on wave soldering machines in the IVP CA lines yields higher productivity and better quality. This report describes the results of optimizing four control factors on the wave soldering machine to achieve reduced solderability defective rate using the Taguchi technique of experimental design and the Response Surface Methodology (RSM). The four control factors explored were Solder Pot Temperature, Conveyor Speed, Preheat Temperature and Solder Pot Height.en_US
dc.format.extent117 p.-
dc.language.isoen-
dc.rightsNANYANG TECHNOLOGICAL UNIVERSITYen_US
dc.subjectDRNTU::Engineering::Electrical and electronic engineering::Electronic apparatus and materials-
dc.titleOptimization of wave soldering using Taguchi methoden_US
dc.typeThesisen_US
dc.contributor.supervisorOoi, Tian Hocken_US
dc.contributor.schoolSchool of Electrical and Electronic Engineeringen_US
dc.description.degreeMaster of Science (Consumer Electronics)en_US
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item.grantfulltextrestricted-
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