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Title: Investigation of flexible bellow for cooling isolated electronic components
Authors: Zheng, Yun.
Keywords: DRNTU::Engineering::Manufacturing
Issue Date: 1996
Abstract: The present work investigates the method of indirect liquid cooling employing a flexible bellow liquid heat sink sandwiched between two hot plates in electronic package. The scope of the project includes the formulation and development of a vertically averaged 2-D numerical model to simulate the heat and fluid flow phenomena in the bellow. The numerical model applies the finite volume method on a staggered grid. Solutions are obtained using the TDMA (TriDiagonal-Matrix Algorithm) and pressure-velocity correction technique. The numerical model is assessed by experimental work in a previous study and is found to be in fair agreement.
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MAE Theses

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