Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/19909
Title: Machine-vision guided underfill dispense system for direct chip attach electronics packages
Authors: Wong, Jordan How Tho.
Keywords: DRNTU::Engineering::Manufacturing
Issue Date: 1998
Abstract: The Jetski production was initiated to make pagers that contained high valued-added components. The processes of assembling the components into the pagers adopted the Direct Chip Attach or Flip Chip technique. One of the processes, known as underfill operation, was designed by the author.
URI: http://hdl.handle.net/10356/19909
Rights: NANYANG TECHNOLOGICAL UNIVERSITY
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MAE Theses

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