Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/19915
Title: Cost modeling of multichip modules substrates technology in concurrent engineering
Authors: Mok, Mun Fai.
Keywords: DRNTU::Engineering::Manufacturing
Issue Date: 1997
Abstract: Choosing and developing advance electronic packaging technology to meet product needs often carry ill-affordable alternatives late into the decision process. During the concept exploration and defmition (CE & D) phase of products and its manufacturing processes, designers must be able to assess both the performance and cost impacts of their choices. Early decisions made during the CE & D phase will drive the cost of future programs/products more than any other phase of development.
URI: http://hdl.handle.net/10356/19915
Rights: NANYANG TECHNOLOGICAL UNIVERSITY
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MAE Theses

Files in This Item:
File Description SizeFormat 
MAE_THESES_178.pdf
  Restricted Access
12.63 MBAdobe PDFView/Open

Google ScholarTM

Check

Items in DR-NTU are protected by copyright, with all rights reserved, unless otherwise indicated.