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Title: Cost modeling of multichip modules substrates technology in concurrent engineering
Authors: Mok, Mun Fai.
Keywords: DRNTU::Engineering::Manufacturing
Issue Date: 1997
Abstract: Choosing and developing advance electronic packaging technology to meet product needs often carry ill-affordable alternatives late into the decision process. During the concept exploration and defmition (CE & D) phase of products and its manufacturing processes, designers must be able to assess both the performance and cost impacts of their choices. Early decisions made during the CE & D phase will drive the cost of future programs/products more than any other phase of development.
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MAE Theses

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