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|Title:||Cost modeling of multichip modules substrates technology in concurrent engineering||Authors:||Mok, Mun Fai.||Keywords:||DRNTU::Engineering::Manufacturing||Issue Date:||1997||Abstract:||Choosing and developing advance electronic packaging technology to meet product needs often carry ill-affordable alternatives late into the decision process. During the concept exploration and defmition (CE & D) phase of products and its manufacturing processes, designers must be able to assess both the performance and cost impacts of their choices. Early decisions made during the CE & D phase will drive the cost of future programs/products more than any other phase of development.||URI:||http://hdl.handle.net/10356/19915||Rights:||NANYANG TECHNOLOGICAL UNIVERSITY||Fulltext Permission:||restricted||Fulltext Availability:||With Fulltext|
|Appears in Collections:||MAE Theses|
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