Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/19915
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dc.contributor.authorMok, Mun Fai.en_US
dc.date.accessioned2009-12-14T07:12:46Z-
dc.date.available2009-12-14T07:12:46Z-
dc.date.copyright1997en_US
dc.date.issued1997-
dc.identifier.urihttp://hdl.handle.net/10356/19915-
dc.description.abstractChoosing and developing advance electronic packaging technology to meet product needs often carry ill-affordable alternatives late into the decision process. During the concept exploration and defmition (CE & D) phase of products and its manufacturing processes, designers must be able to assess both the performance and cost impacts of their choices. Early decisions made during the CE & D phase will drive the cost of future programs/products more than any other phase of development.en_US
dc.format.extent96 p.-
dc.language.isoen-
dc.rightsNANYANG TECHNOLOGICAL UNIVERSITYen_US
dc.subjectDRNTU::Engineering::Manufacturing-
dc.titleCost modeling of multichip modules substrates technology in concurrent engineeringen_US
dc.typeThesisen_US
dc.contributor.supervisorLeong, Kah Faien_US
dc.contributor.schoolSchool of Mechanical and Production Engineeringen_US
dc.description.degreeMaster of Scienceen_US
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