Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/19929
Title: Use of microporous heat sink for high-heat flux electronics
Authors: Cui, Chi.
Keywords: DRNTU::Engineering::Mechanical engineering
Issue Date: 1997
Abstract: Cooling technique is an important factor for the development of electronic systems. The low permeability microporous material has been used as an effective heat sink for thermal management for electronic devices, because it can provide a large surface area to volume ratio and enhance the heat transfer. This thesis presents results of an analytical study on the flow field and the heat transfer of using the low permeability porous medium as a heat sink for cooling of electronic devices.
URI: http://hdl.handle.net/10356/19929
Rights: NANYANG TECHNOLOGICAL UNIVERSITY
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MAE Theses

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