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Title: Design of heat tunnel for a wire bonder
Authors: Goh, Swee Leong.
Keywords: DRNTU::Engineering::Manufacturing
Issue Date: 1997
Abstract: This project aims to develop a heat tunnel work-handling system for a wire bonder. The wire bonder machine is used in semiconductor industry to connect bonding pads on silicon chips to the leads on the leadframes. The design requirement of this new system is to enable bare copper leadframe to be used in the machine. The die attach material between die and bare copper leadframe after die-attach can also be cured within the heat tunnel system before the wire bonding process.
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MAE Theses

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