Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/20415
Title: Evaluation of process requirements for room temperature direct copper bonding
Authors: Chen, Qiang.
Keywords: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
Issue Date: 2009
Abstract: Direct metal bonding is a method of joining two metal surfaces under ambient conditions without an intermediate layer in between. In this thesis, by coating the copper surface with a self assembled monolayer of alkanethiol prior to bonding, Cu joints can be successfully formed at room temperature in ambient environment, yielding joint shear strength up to 60MPa. Copper bond shear strength of 15 MPa is achieved even at 50MPa at 25°C with copper coated with C18. The densely packed monolayer serves to passivate the copper surface against oxidation under ambient conditions. The ultrathin (1-3 nm) organic monolayer structure, as compared to a bulk oxide layer, could be easily displaced during the mechanical deformation at the bonding interface. Preliminary results have shown copper samples bond even at room temperature with SAMs. Such promising results demonstrate great potential in reducing thermal budget in 3-D integrated devices, thus translating to better reliability and performance device.
URI: http://hdl.handle.net/10356/20415
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MSE Student Reports (FYP/IA/PA/PI)

Files in This Item:
File Description SizeFormat 
Evaluation of Process Requirements for Room Temperature Direct Copper Bonding.pdf
  Restricted Access
2.79 MBAdobe PDFView/Open

Page view(s) 50

253
checked on Sep 27, 2020

Download(s)

5
checked on Sep 27, 2020

Google ScholarTM

Check

Items in DR-NTU are protected by copyright, with all rights reserved, unless otherwise indicated.