Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/20446
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dc.contributor.authorKoh, Loo Yee.en_US
dc.date.accessioned2009-12-15T03:00:09Z-
dc.date.available2009-12-15T03:00:09Z-
dc.date.copyright1997en_US
dc.date.issued1997-
dc.identifier.urihttp://hdl.handle.net/10356/20446-
dc.description.abstractThis project seek to develop and characterise a new rubber-toughened moulding compound for microelectronics encapsulation purposes. The system evaluated was a poly(isocyanurate-oxazolidone) (ISOX) material with an elastomeric castor oil based polyurethane (PU) as the modifier phase. The reaction system consisted of a polyfunctional 4,4-diphenylmethane diisocyanate (PolyMDI), diglycidyl ether of bisphenol A (DGEBA), castor oil and an amine catalyst Ancamine K54. The ISOX matrix phase was formed by reacting DGEBA with PolyMDI and the rubbery PU phase from castor oil and PolyMDI. This PU phase was incorporated into the ISOX matrix through covalently bonding the two materials via various chemical reactions. The objectives of the project include studying the cure behaviour of the ISOX and PU systems and to optimise their cure conditions. The effects of varying concentration of the toughening phases on the physical, mechanical and thermal properties of the system were characterised.en_US
dc.format.extent163 p.-
dc.language.isoen-
dc.rightsNANYANG TECHNOLOGICAL UNIVERSITYen_US
dc.subjectDRNTU::Engineering::Materials::Microelectronics and semiconductor materials-
dc.titleDevelopment of a new material for microelectronics encapsulationen_US
dc.typeThesisen_US
dc.contributor.supervisorChian, Kerm Sinen_US
dc.contributor.schoolSchool of Applied Scienceen_US
dc.description.degreeMaster of Applied Scienceen_US
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