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|Title:||Computer aided IC packaging design||Authors:||Zahiruddin A. K. M.||Keywords:||DRNTU::Engineering::Manufacturing::CAD/CAM systems||Issue Date:||1998||Abstract:||In recent years knowledge based applications have gained access in many areas of engineering. This kind of approach is particularly appropriate, among others, in solving problems related to selection, classification, configuration, diagnosis, monitoring and planning.||URI:||http://hdl.handle.net/10356/20525||Rights:||NANYANG TECHNOLOGICAL UNIVERSITY||Fulltext Permission:||restricted||Fulltext Availability:||With Fulltext|
|Appears in Collections:||SIMTECH Theses|
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