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Title: A Window clamp mechanism design for thermosonic gold wire bonding
Authors: Kwan, Ka Shing.
Keywords: DRNTU::Engineering::Manufacturing::Product engineering
Issue Date: 1996
Abstract: In the semi-conductor packaging industry, integrated circuits (ICs) are packaged by a series of assembly processes. Among these assembly processes, wire bonding is the one demanding the highest precision. The purpose of wire bonding is to connect the ICs to the circuitry of the substrate and then to the outside world. At present, thermosonic bonding is one of the most commonly used methods for gold wire bonding between ICs and the metal lead frame fingers. In this process, the silicon die and the lead frame fingers on a bonding unit is heated up. Then, gold wires are welded to the metallic coated pads and then to the lead frame fingers with the combination of ultrasonic energy and thermal energy.
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:SIMTECH Theses

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