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|Title:||Design of a new bonding machine||Authors:||Wong, Yam Mo.||Keywords:||DRNTU::Engineering::Manufacturing::Product engineering||Issue Date:||1996||Abstract:||The purpose of this project is to design a new bonding machine to replace a five-year old machine. This bonding machine is used in semiconductor industry to do wire bonding that is a process using gold wire to connect bonding pads on die to leads. The design requirements of this new machine are to increase throughput, improve machine stability, enhance process capability and provide simpler operation so as to maintain its competitiveness in the market. The concepts to achieve the design requirements are described in this report.||URI:||http://hdl.handle.net/10356/20562||Rights:||NANYANG TECHNOLOGICAL UNIVERSITY||Fulltext Permission:||restricted||Fulltext Availability:||With Fulltext|
|Appears in Collections:||SIMTECH Theses|
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