Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/20564
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dc.contributor.authorChung, Kok Wah.en_US
dc.date.accessioned2009-12-15T03:22:53Z-
dc.date.available2009-12-15T03:22:53Z-
dc.date.copyright1995en_US
dc.date.issued1995-
dc.identifier.urihttp://hdl.handle.net/10356/20564-
dc.description.abstractDetermining the root cause of machine/process failure plays a critical role in machine uptime and utilisation which directly impacts productivity. Rapid, accurate diagnosis is key to determining the root cause of failure. This Wirebonding Diagnostic Assistant (WBDA) is used to diagnose both process and machine related problems and also act as a training system for the wire bonding process. This WBDA is able to advise the technical support staff in the troubleshooting of six major thermosonic wirebonding process problems, namely golf ball, broken stitch, irregular wire loop, lifted stitch, cratering and non-sticking problems. It is also able to allow the user to enter the symptoms observed and find for possible/potential faults that are arising.en_US
dc.format.extent205 p.-
dc.language.isoen-
dc.rightsNANYANG TECHNOLOGICAL UNIVERSITYen_US
dc.subjectDRNTU::Engineering::Manufacturing-
dc.titleA Knowledge-based system for semiconductor wirebonding process and machine troubleshootingen_US
dc.typeThesisen_US
dc.contributor.supervisorHo, Hiang Kweeen_US
dc.description.degree​Master of Science (Computer Integrated Manufacturing)en_US
dc.contributor.researchGintic Institute of Manufacturing Technologyen_US
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item.grantfulltextrestricted-
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