Singapore MIT Alliance (SMA) / SMA Office

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Recent Submissions

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Quantification of subcellar localization and co-localization from high-content images
Multi-objective scheduling in PCB assembly manufacturing : discrete event simulation approach
Building an intelligent e-diagnostics system for reducing mean time to repair (MTTR) of wire bond machines
Monolithic integration of GAAS-to-SI by direct wafer bonding
Design of a more effective vibration test method in gauge production

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