Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/2499
Title: Anisotropic conductive adhesives for micro joining in semiconductor interconnect applications
Authors: Teo, Mary.
Keywords: DRNTU::Engineering::Materials::Material testing and characterization
Issue Date: 2003
Abstract: The main objective in this study was to identify the impact of material properties on reliability, so as to engineer highly reliable microelectronics assemblies.
URI: http://hdl.handle.net/10356/2499
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:SCSE Theses

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