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Title: Design of on-package RF dual-band filter
Authors: Anak Agung Alit Apriyana
Keywords: DRNTU::Engineering::Electrical and electronic engineering::Wireless communication systems
Issue Date: 2004
Abstract: In this project, a dual-band BPF for the concurrent dual-band wireless transceiver was developed. The dual-band BPF was implemented using ceramic material to obtain a low insertion loss performance. In order to minimize the device area, the dual-band BPF was place on the top of the IC package. In this case, the filter was implemented using a transmission line rather than a lumped element to minimize losses.
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:SCSE Theses

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