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|Title:||Copper interconnect by filtered cathodic vacuum arc technique||Authors:||Lau, Daniel Shu Ping
Tay, Beng Kang
|Keywords:||DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging||Issue Date:||2003||Abstract:||This project discussed the copper interconnect by filtered cathodic vacuum arc technique.||URI:||http://hdl.handle.net/10356/2884||Rights:||Nanyang Technological University||Fulltext Permission:||restricted||Fulltext Availability:||With Fulltext|
|Appears in Collections:||EEE Research Reports (Staff & Graduate Students)|
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