Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/2884
Title: Copper interconnect by filtered cathodic vacuum arc technique
Authors: Lau, Daniel Shu Ping
Tay, Beng Kang
Shi, Xu
Keywords: DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging
Issue Date: 2003
Abstract: This project discussed the copper interconnect by filtered cathodic vacuum arc technique.
URI: http://hdl.handle.net/10356/2884
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:EEE Research Reports (Staff & Graduate Students)

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