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https://hdl.handle.net/10356/2896| Title: | Development of copper metallization for Deep Submicron Integrated Circuits (DSICs) | Authors: | Krishnamachar Prasad Zhang, Dao Hua Tan, Cher Ming |
Keywords: | DRNTU::Engineering::Electrical and electronic engineering::Integrated circuits | Issue Date: | 2004 | Abstract: | The development of copper metallization for deep submicron integrated circuits (DSICs) was a project jointly funded by the Ministry of Education (MoE) and the Agency for Science Technology and Research (A*STAR). Being a very broad based project, the report is deliberately divided into 3 parts. Each part is a complete report by itself - complete with summary, table of contents and various chapters. The 3 parts are identified as follows: | URI: | http://hdl.handle.net/10356/2896 | Schools: | School of Electrical and Electronic Engineering | Rights: | Nanyang Technological University | Fulltext Permission: | restricted | Fulltext Availability: | With Fulltext |
| Appears in Collections: | EEE Research Reports (Staff & Graduate Students) |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| EEE-RESEARCH-REPORT_294.pdf Restricted Access | 31.62 MB | Adobe PDF | View/Open |
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