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Title: Development of copper metallization for Deep Submicron Integrated Circuits (DSICs)
Authors: Krishnamachar Prasad
Zhang, Dao Hua
Tan, Cher Ming
Keywords: DRNTU::Engineering::Electrical and electronic engineering::Integrated circuits
Issue Date: 2004
Abstract: The development of copper metallization for deep submicron integrated circuits (DSICs) was a project jointly funded by the Ministry of Education (MoE) and the Agency for Science Technology and Research (A*STAR). Being a very broad based project, the report is deliberately divided into 3 parts. Each part is a complete report by itself - complete with summary, table of contents and various chapters. The 3 parts are identified as follows:
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:EEE Research Reports (Staff & Graduate Students)

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