Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/3141
Title: GA based hybrid tier packing approach for three dimensional packing
Authors: Poh, Terence Eng Hua
Keywords: DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging
Issue Date: 2005
Source: Poh, T. E. H. (2005). GA based hybrid tier packing approach for three dimensional packing. Master’s thesis, Nanyang Technological University, Singapore.
Abstract: This thesis proposed the Hybrid Tier Packing Approach for solving three dimensional packing problems. HTPA uses both heuristic and GA to conduct its packing for each tier. Heuristic packing is used for solving simpler tier packing problems while GA packing is used for solving the tougher and more complex tier packing problems. By applying suitable packing methods for solving the two difficulty classes of tier packing problems, optimal packing results can be obtained in a time efficient manner.
URI: https://hdl.handle.net/10356/3141
DOI: 10.32657/10356/3141
Rights: Nanyang Technological University
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:EEE Theses

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