Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/3366
Title: Integration of electroless copper and electrolytic copper plating
Authors: Tan, Kee Tchuan.
Keywords: DRNTU::Engineering::Electrical and electronic engineering::Semiconductors
Issue Date: 2002
Abstract: This thesis presents our findings on the electroless Cu seed deposition process as well as its integration to mainstream Cu electroplating bulk-fill. Initial works include formulating (in-house) a suitable electronless Cu bath composition, and identifying appropriate catalyzation techniques to initiate the electronless Cu film growth.
URI: http://hdl.handle.net/10356/3366
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:EEE Theses

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