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Title: Investigation of via2 chain test structure high resistance failure
Authors: Tan, Tze Han.
Keywords: DRNTU::Engineering::Electrical and electronic engineering::Microelectronics
Issue Date: 2002
Abstract: This report covers an investigation into the failure mechanism behind the via resistance failure in an electrical test structure. Intermittent high resistance failures occur in the via 2 chain test structure for a certain process. The failed wafers showed marginally high resistance at max 4 ohm/via (max specification: 1.2 ohm/via).
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:EEE Theses

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