A study on electromigration by driving force approach for submicron copper interconnect.
Date of Issue2007
School of Electrical and Electronic Engineering
The prime interest of this thesis work is to investigate the physics of electromigration failure in submicron Cu interconnections including the effect of surrounding materials. A combined driving force model, including the forces from the stress and temperature gradients is presented. Experiments are conducted and good correlations with model predictions are obtained.
DRNTU::Engineering::Electrical and electronic engineering::Integrated circuits
Nanyang Technological University