Please use this identifier to cite or link to this item:
https://hdl.handle.net/10356/3479
Title: | A study on electromigration by driving force approach for submicron copper interconnect | Authors: | Roy, Arijit | Keywords: | DRNTU::Engineering::Electrical and electronic engineering::Integrated circuits | Issue Date: | 2007 | Source: | Roy, A. (2007). A study on electromigration by driving force approach for submicron copper interconnect. Doctoral thesis, Nanyang Technological University, Singapore. | Abstract: | The prime interest of this thesis work is to investigate the physics of electromigration failure in submicron Cu interconnections including the effect of surrounding materials. A combined driving force model, including the forces from the stress and temperature gradients is presented. Experiments are conducted and good correlations with model predictions are obtained. | URI: | https://hdl.handle.net/10356/3479 | DOI: | 10.32657/10356/3479 | Rights: | Nanyang Technological University | Fulltext Permission: | open | Fulltext Availability: | With Fulltext |
Appears in Collections: | EEE Theses |
Files in This Item:
File | Description | Size | Format | |
---|---|---|---|---|
EEE-THESES_1337.pdf | 3.48 MB | Adobe PDF | ![]() View/Open |
Page view(s) 50
374
Updated on Apr 22, 2021
Download(s) 20
155
Updated on Apr 22, 2021
Google ScholarTM
Check
Altmetric
Items in DR-NTU are protected by copyright, with all rights reserved, unless otherwise indicated.