Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/3479
Title: A study on electromigration by driving force approach for submicron copper interconnect
Authors: Roy, Arijit
Keywords: DRNTU::Engineering::Electrical and electronic engineering::Integrated circuits
Issue Date: 2007
Source: Roy, A. (2007). A study on electromigration by driving force approach for submicron copper interconnect. Doctoral thesis, Nanyang Technological University, Singapore.
Abstract: The prime interest of this thesis work is to investigate the physics of electromigration failure in submicron Cu interconnections including the effect of surrounding materials. A combined driving force model, including the forces from the stress and temperature gradients is presented. Experiments are conducted and good correlations with model predictions are obtained.
URI: https://hdl.handle.net/10356/3479
DOI: 10.32657/10356/3479
Rights: Nanyang Technological University
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:EEE Theses

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