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Title: Stress measurement in copper films
Authors: Teo, Chee Hiang.
Keywords: DRNTU::Engineering::Electrical and electronic engineering::Electronic apparatus and materials
Issue Date: 2003
Abstract: The aim is to study the behaviour of copper film stack deposited on silicon wafers as a function of temperature and time by monitoring the sample curvvature during a specified thermal history.
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:EEE Theses

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