Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/3576
Title: New techniques for localization of shorted and open interconnect failures in ICs by using laser beam technology
Authors: Thaw Zin Myint.
Keywords: DRNTU::Engineering::Electrical and electronic engineering::Integrated circuits
Issue Date: 2004
Abstract: Open-circuit and short-circuit defects in electrical conductors within integrated circuits (ICs) can result in major IC yield and reliability problems. A capability for localizing and identifying these types of defects is important for analyzing ICs to determine failure mechanisms therein, for qualifying ICs as known-good devices, and for implementing corrective action during IC fabrication to minimize the occurrence of such defects.
URI: http://hdl.handle.net/10356/3576
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:EEE Theses

Files in This Item:
File Description SizeFormat 
EEE-THESES_1424.pdf
  Restricted Access
13.43 MBAdobe PDFView/Open

Page view(s) 5

221
checked on Sep 22, 2020

Download(s) 5

5
checked on Sep 22, 2020

Google ScholarTM

Check

Items in DR-NTU are protected by copyright, with all rights reserved, unless otherwise indicated.