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Title: A structured approach for routing of high density PCB
Authors: Thein Po.
Keywords: DRNTU::Engineering::Electrical and electronic engineering::Electronic circuits
Issue Date: 2005
Abstract: The aim of this project is to design a Structured Methodology for Routing of High Density Printed Circuit Board (PCB). PCB may include the through hole components and Surface Mounted Technology (SMT) components. The routing methodology is based on the Modularized Routing Methodology. This methodology can guarantee 100% completion of auto routing and pre-determine the number of layer required.
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:EEE Theses

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