Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/35957
Title: Study and development of advanced packaging technique for semiconductor lasers
Authors: Teo, Ronnie Jin Wah
Keywords: DRNTU::Engineering::Materials::Electronic packaging materials
Issue Date: 2007
Source: Teo, R. J. W. (2007). Study and development of advanced packaging technique for semiconductor lasers. Doctoral thesis, Nanyang Technological University, Singapore.
Abstract: The development of Erbium-Doped Fiber Amplifiers (EDFA) in long-haul telecommunications applications resulted in the rapid evolution of high power semiconductor lasers. In these applications, the demand for increased channel density in fiber-optic communication has pushed forward the use of single-mode ridge-waveguide laser diodes (LDs).
Description: 213 p.
URI: https://hdl.handle.net/10356/35957
DOI: 10.32657/10356/35957
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:MSE Theses

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