Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/35960
Title: Investigation of cure stresses in non-conductive adhesive interconnects
Authors: Yu, Hong
Keywords: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
Issue Date: 2007
Source: Yu,H. (2007). Investigation of cure stresses in non-conductive adhesive interconnects. Doctoral thesis, Nanyang Technological University, Singapore.
Abstract: Non-conductive adhesives (NCAs) offer cost reduction, simplicity, and flexibility over other electrically conductive adhesives (ECAs) due to an absence of conductive fillers and reduced processing requirements. However, although NCAs are a very promising potential alternative to metallic solder interconnections, there continue to be significant challenges that need to be addressed for their widespread implementation. This investigation focuses on a fundamental study of the mechanical, thermal and rheological properties of NCAs during cure process, the formation of the electrical connectivity, and the mechanisms governing long-term reliability of NCA flip chip interconnects.
Description: 187 p.
URI: https://hdl.handle.net/10356/35960
DOI: 10.32657/10356/35960
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:MSE Theses

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