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|Title:||Investigation of cure stresses in non-conductive adhesive interconnects||Authors:||Yu, Hong||Keywords:||DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects||Issue Date:||2007||Source:||Yu,H. (2007). Investigation of cure stresses in non-conductive adhesive interconnects. Doctoral thesis, Nanyang Technological University, Singapore.||Abstract:||Non-conductive adhesives (NCAs) offer cost reduction, simplicity, and flexibility over other electrically conductive adhesives (ECAs) due to an absence of conductive fillers and reduced processing requirements. However, although NCAs are a very promising potential alternative to metallic solder interconnections, there continue to be significant challenges that need to be addressed for their widespread implementation. This investigation focuses on a fundamental study of the mechanical, thermal and rheological properties of NCAs during cure process, the formation of the electrical connectivity, and the mechanisms governing long-term reliability of NCA flip chip interconnects.||Description:||187 p.||URI:||https://hdl.handle.net/10356/35960||DOI:||10.32657/10356/35960||Fulltext Permission:||open||Fulltext Availability:||With Fulltext|
|Appears in Collections:||MSE Theses|
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