dc.contributor.authorYu, Hongen_US
dc.date.accessioned2010-04-23T02:15:04Z
dc.date.accessioned2017-07-23T08:37:06Z
dc.date.available2010-04-23T02:15:04Z
dc.date.available2017-07-23T08:37:06Z
dc.date.copyright2007en_US
dc.date.issued2007
dc.identifier.citationYu,H. (2007). Investigation of cure stresses in non-conductive adhesive interconnects. Doctoral thesis, Nanyang Technological University, Singapore.
dc.identifier.urihttp://hdl.handle.net/10356/35960
dc.description187 p.en_US
dc.description.abstractNon-conductive adhesives (NCAs) offer cost reduction, simplicity, and flexibility over other electrically conductive adhesives (ECAs) due to an absence of conductive fillers and reduced processing requirements. However, although NCAs are a very promising potential alternative to metallic solder interconnections, there continue to be significant challenges that need to be addressed for their widespread implementation. This investigation focuses on a fundamental study of the mechanical, thermal and rheological properties of NCAs during cure process, the formation of the electrical connectivity, and the mechanisms governing long-term reliability of NCA flip chip interconnects.en_US
dc.subjectDRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
dc.titleInvestigation of cure stresses in non-conductive adhesive interconnectsen_US
dc.typeThesisen_US
dc.contributor.schoolSchool of Materials Science and Engineeringen_US
dc.contributor.supervisorWong Ee-Hua
dc.contributor.supervisorZhang Xiaowu
dc.contributor.supervisorSubodh Gautam Mhaisalkaren_US
dc.description.degreeDOCTOR OF PHILOSOPHY (MSE)en_US


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