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Title: Evaluation of an integrated process of printing and electroless plating for electronic circuit board fabrication
Authors: Lim, Patricia Li Ying.
Keywords: DRNTU::Engineering::Manufacturing
Issue Date: 2007
Abstract: Low temperature co-fired ceramics (LTCCs) are becoming increasingly important in the electronic circuit board fabrication as a result of the introduction of hybrid microelectronics packaging. Here, a novel class of deposition technique developed for the LTCC substrate is presented. This method enables the integration of metal printing and electroless metal plating processes to be realized.
Description: 73 p.
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MAE Theses

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