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|Title:||Evaluation of an integrated process of printing and electroless plating for electronic circuit board fabrication||Authors:||Lim, Patricia Li Ying.||Keywords:||DRNTU::Engineering::Manufacturing||Issue Date:||2007||Abstract:||Low temperature co-fired ceramics (LTCCs) are becoming increasingly important in the electronic circuit board fabrication as a result of the introduction of hybrid microelectronics packaging. Here, a novel class of deposition technique developed for the LTCC substrate is presented. This method enables the integration of metal printing and electroless metal plating processes to be realized.||Description:||73 p.||URI:||http://hdl.handle.net/10356/35992||Fulltext Permission:||restricted||Fulltext Availability:||With Fulltext|
|Appears in Collections:||MAE Theses|
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