Please use this identifier to cite or link to this item:
|Title:||Design and fabrication of RF devices by novel MEMS technologies||Authors:||Sun, Jianbo.||Keywords:||DRNTU::Engineering::Manufacturing::Product design||Issue Date:||2007||Source:||Sun, J. B. (2007). Design and fabrication of RF devices by novel MEMS technologies. Doctoral thesis, Nanyang Technological University, Singapore.||Abstract:||With today's fast expansion of the wireless communication industry, integrated circuits are being driven to a higher level of integration by consumer market that is desired for products with higher performance, low cost, light weight, small size, and minimum power dissipation. The active components such as, diodes, transistors, have been well developed for RFlCs (radio frequency integrated circuits) in the few GHz frequency range and they are easily integrated onto chips using today's IC technologies (CMOS, BiCOMS, BiPolar). However, for the development of RFlCs, passive components including inductors, capacitors, resistors, and filters et al. are indispensable. Unfortunately, these passive devices, especially inductors and filters, are still not satisfied with the RFlCs requirement. The bottlenecks for the full integration to realize SOC (system on chip) are the development of passive components such as inductors and filters with high quality factor and small size.||Description:||205 p.||URI:||http://hdl.handle.net/10356/36024||Fulltext Permission:||open||Fulltext Availability:||With Fulltext|
|Appears in Collections:||MAE Theses|
Items in DR-NTU are protected by copyright, with all rights reserved, unless otherwise indicated.