Design and fabrication of RF devices by novel MEMS technologies
Date of Issue2007
School of Mechanical and Aerospace Engineering
With today's fast expansion of the wireless communication industry, integrated circuits are being driven to a higher level of integration by consumer market that is desired for products with higher performance, low cost, light weight, small size, and minimum power dissipation. The active components such as, diodes, transistors, have been well developed for RFlCs (radio frequency integrated circuits) in the few GHz frequency range and they are easily integrated onto chips using today's IC technologies (CMOS, BiCOMS, BiPolar). However, for the development of RFlCs, passive components including inductors, capacitors, resistors, and filters et al. are indispensable. Unfortunately, these passive devices, especially inductors and filters, are still not satisfied with the RFlCs requirement. The bottlenecks for the full integration to realize SOC (system on chip) are the development of passive components such as inductors and filters with high quality factor and small size.