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https://hdl.handle.net/10356/36056| Title: | Characterization of lead free solder joints in microelectronics assemblies | Authors: | Hla Phone Maw. | Keywords: | DRNTU::Engineering::Mechanical engineering::Mechanics and dynamics | Issue Date: | 2006 | Abstract: | Wafer level packaging using organic substrate is being used for traditional electronic packages in demanding miniaturization of products. The organic substrates may not be the best choice for very high frequency application demanding low loss requirement for few niche applications in communication and defense industries. | Description: | 71 p. | URI: | http://hdl.handle.net/10356/36056 | Schools: | School of Mechanical and Aerospace Engineering | Fulltext Permission: | restricted | Fulltext Availability: | With Fulltext |
| Appears in Collections: | MAE Theses |
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| File | Description | Size | Format | |
|---|---|---|---|---|
| MAE_THESES_19.pdf Restricted Access | 7.81 MB | Adobe PDF | View/Open |
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