Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/36056
Title: Characterization of lead free solder joints in microelectronics assemblies
Authors: Hla Phone Maw.
Keywords: DRNTU::Engineering::Mechanical engineering::Mechanics and dynamics
Issue Date: 2006
Abstract: Wafer level packaging using organic substrate is being used for traditional electronic packages in demanding miniaturization of products. The organic substrates may not be the best choice for very high frequency application demanding low loss requirement for few niche applications in communication and defense industries.
Description: 71 p.
URI: http://hdl.handle.net/10356/36056
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MAE Theses

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