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Title: Automated visual inspection of IC packages
Authors: U Maung Maung Thet
Keywords: DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging
Issue Date: 2002
Abstract: This dissertation focuses on some issues on the automatic inspection of IC packages and presents computer vision based techniques that were developed to perform automatic IC print mark inspection, automatic IC leads inspections, and inspection of the batch numbers on IC packages using the OCR system.
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:EEE Theses

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