Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/3648
Title: Optimization of via patterns for 0.13 micrometer copper dual damascene technology using phase shift mask
Authors: Chen, Hao.
Keywords: DRNTU::Engineering::Electrical and electronic engineering::Microelectronics
Issue Date: 2003
Abstract: The attenuated phase shifting mask has become very popular for printing via patterns in today’s semiconductor manufacturing industry. This is because this is suitable for patterns with any shapes. Also, it has an easier manufacturing technology. Its major disadvantage is the printability of side lobes due to the light that is transmitted through the dark areas.
URI: http://hdl.handle.net/10356/3648
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:EEE Theses

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