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https://hdl.handle.net/10356/3771| Title: | The temperature distribution and thermal stresses induced during processing of partial SOI structures | Authors: | Chen, Junming. | Keywords: | DRNTU::Engineering::Electrical and electronic engineering::Semiconductors | Issue Date: | 2002 | Abstract: | In this work, the numerical results on the distribution of thermal stress at the interface of partial SOI structures are presented. | URI: | http://hdl.handle.net/10356/3771 | Schools: | School of Electrical and Electronic Engineering | Rights: | Nanyang Technological University | Fulltext Permission: | restricted | Fulltext Availability: | With Fulltext |
| Appears in Collections: | EEE Theses |
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| File | Description | Size | Format | |
|---|---|---|---|---|
| EEE-THESES_160.pdf Restricted Access | 7.05 MB | Adobe PDF | View/Open |
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