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|Title:||High-speed programmable divider for wireless communication||Authors:||Wu, Minjie.||Keywords:||DRNTU::Engineering::Electrical and electronic engineering::Wireless communication systems||Issue Date:||2003||Abstract:||The recent boom in the wireless communication market has attracted the interest of almost all electronic and communication companies worldwide. The evolution in microelectronics has played a dominant role in this by creating digital signal processing (DSP) chips with more and more computing power and combining the discrete components of the Radio Frequency (RF) front on a few Integrated Circuits (ICs) or even on a single die. In order to be compatible with the digital processing technology, a standard CMOS process without tuning, trimming or post-processing steps must be used.||URI:||http://hdl.handle.net/10356/3775||Rights:||Nanyang Technological University||Fulltext Permission:||restricted||Fulltext Availability:||With Fulltext|
|Appears in Collections:||EEE Theses|
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