Please use this identifier to cite or link to this item:
Title: Novel integrated circuit pressed ceramic package antenna
Authors: Xue, Yang
Keywords: DRNTU::Engineering::Electrical and electronic engineering::Antennas, wave guides, microwaves, radar, radio
Issue Date: 2004
Abstract: Integrated Circuit Package Antenna (ICPA) has attracted great attention because of their enormous potential in the wireless communication area. It has the advantages of low profile, compact size and lightweight. It is most suitable for portable communication devices, such as hand phone, personal data assistant (PDA), bluetooth products, wireless modem for notebook computer and etc.
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:EEE Theses

Files in This Item:
File Description SizeFormat 
  Restricted Access
9.73 MBAdobe PDFView/Open

Page view(s) 50

Updated on Nov 29, 2020

Download(s) 50

Updated on Nov 29, 2020

Google ScholarTM


Items in DR-NTU are protected by copyright, with all rights reserved, unless otherwise indicated.