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https://hdl.handle.net/10356/3934| Title: | Fabrication and characterization of silicon-on-insulator using low temperature wafer bonding | Authors: | Yu, Weibo | Keywords: | DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging | Issue Date: | 2005 | Source: | Yu, W. B. (2005). Fabrication and characterization of silicon- on- insulator using low temperature wafer bonding. Doctoral thesis, Nanyang Technological University, Singapore. | Abstract: | In present study, two low temperature wafer bonding methods, namely the medium vacuum wafer bonding (MVWB) and plasma activated wafer bonding (PAWB), are studied. | URI: | https://hdl.handle.net/10356/3934 | DOI: | 10.32657/10356/3934 | Schools: | School of Electrical and Electronic Engineering | Rights: | Nanyang Technological University | Fulltext Permission: | open | Fulltext Availability: | With Fulltext |
| Appears in Collections: | EEE Theses |
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| File | Description | Size | Format | |
|---|---|---|---|---|
| EEE-THESES_1747.pdf | 19.99 MB | Adobe PDF |  View/Open |
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