Fabrication and characterization of silicon-on-insulator using low temperature wafer bonding
Date of Issue2005
School of Electrical and Electronic Engineering
In present study, two low temperature wafer bonding methods, namely the medium vacuum wafer bonding (MVWB) and plasma activated wafer bonding (PAWB), are studied.
DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging
Nanyang Technological University