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|Title:||Fabrication and characterization of silicon-on-insulator using low temperature wafer bonding||Authors:||Yu, Weibo||Keywords:||DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging||Issue Date:||2005||Source:||Yu, W. B. (2005). Fabrication and characterization of silicon- on- insulator using low temperature wafer bonding. Doctoral thesis, Nanyang Technological University, Singapore.||Abstract:||In present study, two low temperature wafer bonding methods, namely the medium vacuum wafer bonding (MVWB) and plasma activated wafer bonding (PAWB), are studied.||URI:||https://hdl.handle.net/10356/3934||DOI:||10.32657/10356/3934||Rights:||Nanyang Technological University||Fulltext Permission:||open||Fulltext Availability:||With Fulltext|
|Appears in Collections:||EEE Theses|
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