Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/3934
Title: Fabrication and characterization of silicon-on-insulator using low temperature wafer bonding
Authors: Yu, Weibo
Keywords: DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging
Issue Date: 2005
Source: Yu, W. B. (2005). Fabrication and characterization of silicon- on- insulator using low temperature wafer bonding. Doctoral thesis, Nanyang Technological University, Singapore.
Abstract: In present study, two low temperature wafer bonding methods, namely the medium vacuum wafer bonding (MVWB) and plasma activated wafer bonding (PAWB), are studied.
URI: https://hdl.handle.net/10356/3934
DOI: 10.32657/10356/3934
Rights: Nanyang Technological University
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:EEE Theses

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