Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/40566
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dc.contributor.authorJaya Perkhass Santiran
dc.date.accessioned2010-06-16T07:54:02Z
dc.date.available2010-06-16T07:54:02Z
dc.date.copyright2010en_US
dc.date.issued2010
dc.identifier.urihttp://hdl.handle.net/10356/40566
dc.description.abstractMicrofluidics is the science of the interactions of very small amounts of liquid, where certain negligible effects in the macro scale become dominant. Polymer replication technique such as hot embossing is commonly used for the manufacturing of microfluidic device. Aluminum alloy substrates can be used as moulds for embossing microfluidic channels and these moulds are produced through a micromilling process. Micromilling process is able to create 3D microchannels; however micro-sized burrs are created throughout the duration of this process. The main focus of this project is in removing the burrs created by micromilling process. Miniature brushes with abrasive filaments are used as a de-burring tool to achieve this. Effectiveness of the de-burring brushes are evaluated by combining different machining parameters such as, spindle speed (rpm), feed rate (mm/min), depth of cut (mm), and direction of cut. Experimental results, in the form of SEM pictures are compared to study on the brushes de-burring efficiency and to obtain the finest de-burring parameters. Microscopy profile of surface cross-sections and brush flaring effect are also studied to determine the effect of de-burring brushes on the microchannels.en_US
dc.format.extent67 p.en_US
dc.language.isoenen_US
dc.rightsNanyang Technological University
dc.subjectDRNTU::Engineering::Mechanical engineeringen_US
dc.titleInvestigations in de-burring on micromilled channelsen_US
dc.typeFinal Year Project (FYP)en_US
dc.contributor.supervisorSathyan Subbiahen_US
dc.contributor.schoolSchool of Mechanical and Aerospace Engineeringen_US
dc.description.degreeBachelor of Engineering (Mechanical Engineering)en_US
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Appears in Collections:MAE Student Reports (FYP/IA/PA/PI)
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