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|Title:||Carbon doped silicon oxides for low k dielectric applications in multilevel interconnects||Authors:||Liu, Bo||Keywords:||DRNTU::Engineering::Electrical and electronic engineering::Electric apparatus and materials||Issue Date:||2008||Source:||Liu, B. (2008). Carbon doped silicon oxides for low k dielectric applications in multilevel interconnects. Master’s thesis, Nanyang Technological University, Singapore.||Abstract:||This project aims at deposition and characterization of carbon doped silicon oxides (SiOCH) low k dieletrics for multilevel interconnect applications. The optical, electrical, mechanical, structural and thermal properties of SiOCH films have been studied.||URI:||https://hdl.handle.net/10356/4112||DOI:||10.32657/10356/4112||Rights:||Nanyang Technological University||Fulltext Permission:||open||Fulltext Availability:||With Fulltext|
|Appears in Collections:||EEE Theses|
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