Stress migration study of Cu/Low-k interconnect system.
Lim, Yeow Kheng.
Date of Issue2008
School of Electrical and Electronic Engineering
This research focuses on the stress-induced voiding in Cu interconnects. The different types, and the process and geometrical dependency of stress-induced voiding are studied. In addition, in-depth understanding of stress-induced voiding mechanisms and process; approaches to improve stress migration reliability and, the extendibility and impacts of the approaches to future technologies, are discussed.
DRNTU::Engineering::Electrical and electronic engineering::Electronic systems
Nanyang Technological University