Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/4139
Title: Study of VIA-related failures in sub-micron technologies
Authors: Chia, Gary Yue Choy.
Keywords: DRNTU::Engineering::Electrical and electronic engineering::Microelectronics
Issue Date: 2003
Abstract: An investigation into the Back-end of Line (BEOL) Via Related failures is presented in this report. It documents the various process issues seen and the optimization carried out in the BEOL scheme that helps to tackle this issue. The thought process and the experimental results are also highlighted.
URI: http://hdl.handle.net/10356/4139
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:EEE Theses

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