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https://hdl.handle.net/10356/41563| Title: | Micro-deformation characterization of electronic packaging materials and assemblies | Authors: | Sun, Yao Feng | Keywords: | DRNTU::Engineering::Mechanical engineering | Issue Date: | 2008 | Source: | Sun, Y. F. (2008). Micro-deformation characterization of electronic packaging materials and assemblies. Doctoral thesis, Nanyang Technological University, Singapore. | Abstract: | The continuing miniaturization of microelectronic assemblies and devices requires experimental micro-deformation analysis technique for material characterization and structure reliability analysis. This work investigates both theoretical aspects and practical applications of digital image correlation techniques for in-plane micro- and non-scale deformation characterization of electronic packaging materials and assemblies. | URI: | https://hdl.handle.net/10356/41563 | DOI: | 10.32657/10356/41563 | Schools: | School of Mechanical and Aerospace Engineering | Fulltext Permission: | open | Fulltext Availability: | With Fulltext |
| Appears in Collections: | MAE Theses |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| SunYaofeng08.pdf | 38.41 MB | Adobe PDF |  View/Open |
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