Micro-deformation characterization of electronic packaging materials and assemblies.
Sun, Yao Feng.
Date of Issue2008
School of Mechanical and Aerospace Engineering
The continuing miniaturization of microelectronic assemblies and devices requires experimental micro-deformation analysis technique for material characterization and structure reliability analysis. This work investigates both theoretical aspects and practical applications of digital image correlation techniques for in-plane micro- and non-scale deformation characterization of electronic packaging materials and assemblies.