Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/41563
Title: Micro-deformation characterization of electronic packaging materials and assemblies
Authors: Sun, Yao Feng
Keywords: DRNTU::Engineering::Mechanical engineering
Issue Date: 2008
Source: Sun, Y. F. (2008). Micro-deformation characterization of electronic packaging materials and assemblies. Doctoral thesis, Nanyang Technological University, Singapore.
Abstract: The continuing miniaturization of microelectronic assemblies and devices requires experimental micro-deformation analysis technique for material characterization and structure reliability analysis. This work investigates both theoretical aspects and practical applications of digital image correlation techniques for in-plane micro- and non-scale deformation characterization of electronic packaging materials and assemblies.
URI: https://hdl.handle.net/10356/41563
DOI: 10.32657/10356/41563
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:MAE Theses

Files in This Item:
File Description SizeFormat 
SunYaofeng08.pdf38.41 MBAdobe PDFThumbnail
View/Open

Page view(s) 50

312
Updated on May 13, 2021

Download(s) 20

174
Updated on May 13, 2021

Google ScholarTM

Check

Altmetric


Plumx

Items in DR-NTU are protected by copyright, with all rights reserved, unless otherwise indicated.