Please use this identifier to cite or link to this item:
|Title:||Quality improvement for molding process||Authors:||Yang, Chang Cheng||Keywords:||DRNTU::Engineering::Manufacturing::Quality control||Issue Date:||2008||Abstract:||Molding process is a process of fixing the molding compound onto the substrate to make the IC body. From the analyses of the current quality practice in company, it was found that the main defects associated with the molding process were substrate crack, mold bleed and wire sweep. The main problems which caused these defects were solder mask cannot withstand molding machine pressure; substrate thickness variation caused mold bleed in one direction; and susbstrate warpage caused wire sweep.||URI:||http://hdl.handle.net/10356/41579||Fulltext Permission:||restricted||Fulltext Availability:||With Fulltext|
|Appears in Collections:||MAE Theses|
Items in DR-NTU are protected by copyright, with all rights reserved, unless otherwise indicated.